high precision (sub-μm) measurements.
Accurate pre-alignment of wafers is key for each individual processing step. Contactless wafer edge measurement requires a dedicated vision system.
Archives
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wafer inspection.
Wafer inspection and chip inspection require bespoke image hardware and analysis methods.
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inline depth measurement.
We developed a depth sensor that uses the optical interference effect of broadband light between a reference path and signal path to derive the optical path length difference between these two branches.
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lithography lens design.
Demcon focal has the capabilities to design, deliver and qualify one of the most demanding precision optical assemblies: the lithography lens.
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quality control of fuel.
Different fuels often have distinguishable chemical fingerprints.
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in-line sorting system.
Near infrared (NIR) spectroscopy is suitable for polymer detection and it is a rapid, non-destructive analysis method that can be applied to an automatic in-line sorting system.