Accurate pre-alignment of wafers is key for each individual processing step. Contactless wafer edge measurement requires a dedicated vision system.
Wafer inspection and chip inspection require bespoke image hardware and analysis methods.
We developed a depth sensor that uses the optical interference effect of broadband light between a reference path and signal path to derive the optical path length difference between these two branches.
Demcon focal has the capabilities to design, deliver and qualify one of the most demanding precision optical assemblies: the lithography lens.
Different fuels often have distinguishable chemical fingerprints.
Near infrared (NIR) spectroscopy is suitable for polymer detection and it is a rapid, non-destructive analysis method that can be applied to an automatic in-line sorting system.