inspection system for light connectors.

UV focus objective.

Projects for designing and creating lenses do not stop after assembly: lenses need to be qualified and tested against customer requirements.

laser beam shaping.

We developed a UV laser beam delivery system for heat load experiments and wrinkle measurements. 

high precision (sub-μm) measurements.

Accurate pre-alignment of wafers is key for each individual processing step. Contactless wafer edge measurement requires a dedicated vision system.

f-theta lens design.

Laser annealing is growing rapidly in the semicon market. The elementary module for the laser annealing process is a laser beam delivery system that conditions the laser beam such that a uniform annealing is achieved over the surface.

wafer inspection.

Wafer inspection and chip inspection require bespoke image hardware and analysis methods.