Projects for designing and creating lenses do not stop after assembly: lenses need to be qualified and tested against customer requirements.
We developed a UV laser beam delivery system for heat load experiments and wrinkle measurements.
Accurate pre-alignment of wafers is key for each individual processing step. Contactless wafer edge measurement requires a dedicated vision system.
Laser annealing is growing rapidly in the semicon market. The elementary module for the laser annealing process is a laser beam delivery system that conditions the laser beam such that a uniform annealing is achieved over the surface.
Wafer inspection and chip inspection require bespoke image hardware and analysis methods.